Summary:
Olympus should implement ETH bonds to supplement DAI bonds to diversify away from DAI as the sole reserve asset and to reduce DAI supply bottleneck on Ohm supply growth. The Protocol can leverage the new ETH to initiate Maker CDP positions to mint DAI in a capital-efficient manner to back new sOhm while gaining an additional source of revenue.
Background:
Currently each newly minted sOhm is backed by 1 DAI worth of risk-free value. Through DAI bond this process is 100% efficient as the risk-free value of 1 DAI is 1 DAI. However, DAI bonds are often absorbed by current Ohm stakers. They unstake and sell their Ohm, swap to Dai via the Sushiswap LP pool, and rebond. While this internal bond rollover is not detrimental, it merely helps the Protocol realize the DAI liquidity that it had all along. The Protocol could have simply removed that DAI from the pool itself and minted the sOhm directly.
More over, by tying the supply of Ohm to the supply of DAI, the total supply of Ohm is capped to maximum number of Dai in circulation (~$4.5B). Olympus is already in the Top 120 for largest DAI wallet. We can only grow to the extent that the Protocol can continue to absorb Dai from the market. However, most of the DAI float is already locked in various vault contracts. In reality, the amount of available DAI is much smaller than even the circulating supply. Therefore, Olympus will likely experience a DAI supply bottleneck sooner rather than later.
Abstract:
Under the ETH bond proposal, the Bonder would use ETH instead of DAI to bond. We can be sure that we’re taking in new capital instead of realized SLP liquidity. The other bonding mechanics are the same i.e. the Bonder will get a certain amount of Ohm at a discounted price which will vest over 5-days. The Bonder would save gas by not having to swap out of ETH to DAI to bond. This reduces frictions and gains capital efficiency.
The Protocol will treat the ETH differently than DAI. Instead of discounting the ETH heavily like it would for a Sushi LP token, the Protocol would send the collected ETH on a regular basis to a DAO-controlled Maker Vault to generate or add to a collateralized debt position (CDP) to mint new DAI directly. Currently the Max Collateralization Ratio for ETH in a Make vault is 150%. If the market price of ETH were at $3000, Olympus Maker Vault could mint up to $2000 DAI. This new DAI could back the minting of new sOhm in the Total Supply for distribution. Alternatively, the new DAI could be partially deployed elsewhere such as a Yearn vault to earn yield.
Other Considerations:
Stability Fee: The Stability fee for Maker Dai vault is 5.5%. The fee gets added to the debt position. The Protocol could choose to pay using income generated from the minted DAI, or burn the excess Dai on a regular basis to maintain the original collateralization ratio. Alternatively, the Protocol can simply mint at a low collateralization ratio and allow the debt to build at a sustainable rate.
Liquidation Risk: In the worst-case scenario where the DAO’s ETH collateral is liquidated, it could recover the collateral by using a Keeper bot to bid at par value using DAI from its own Treasury. In an alternative scenario, the DAO could simply allow the collateral to be liquidated to reduce price exposure and debt. The DAO still owns up to 60%-100% of the current ETH value in the form of DAI and had no price exposure to ETH during the downturn that would have otherwise forced removal of sOhm from the supply to maintain backing.
Smart Contract Risk: ETH collateral in Maker vaults are subject to external smart contract risk (while the minted Dai is not). However, the Maker DAO runs a world-class protocol that is battle-tested and draws from years of experience. The smart contract risk would not be substantially different from simple liquidation risk.
Motivation:
To realize its vision as a true multi-asset crypto-backed currency, Olympus needs to diversify away from DAI and exert greater control over its own destiny. This proposal only addresses ETH vaults, but a potential Maker integration would open up a whole new world of possibilities through the creation of a multi-asset CDP that can be tailored to meet our monetary policy objectives. New Ohm bonds can be created as-needed to absorb any new asset that is compatible with Maker CDP vaults (UNI, wBTC, LINK, PAXOS, YFI, AAVE, COMP etc). This should trigger a flood of new capital. In effect Olympus would abandon the inefficient RFV ratio for minting and use the Maker vault collateralization ratio instead as the baseline. By boot-strapping off Maker vault contracts, the DAO will be free to focus on monetary policy and growth instead of building infrastructure from the ground up. If the new ETH bond were paired with a lowering of the APY, the public will view Ohm in a different light and the Olympus Protocol will attain a whole new level of legitimacy relative to its peers.
FOR: Olympus should implement ETH bonds and manage the ETH via a Maker CDP Position
AGAINST: Olympus should not implement ETH bonds